Innovative Power Management in Water Scooters: Lithium Batteries,
BMS, and PCBA Technology
As the demand for eco-friendly, high-performance water scooters
rises, integrating Lithium Battery Systems, Battery Management
Systems (BMS), and Printed Circuit Board Assemblies (PCBA) is crucial for maximizing performance, safety, and longevity.
Who We Are
XHT is an All-in-One solution provider for the fabrication of
high-reliability, multi-layer, complex boards. Our PCBA services
include supply chain management, assembly, test & inspection,
rework, and NPI (New Product Introduction). The combination of our
experience since 2004 in PCB & PCBA provision serves as a solid
base for miniaturization solutions, which include organic
substrates and advanced packaging.
What We Do
Our highly experienced team, state-of-the-art technologies, and
advanced processes enable us to deliver innovative and complete
solutions. All this while ensuring cost-effectiveness in a global
network supply chain. A can-do attitude and a heterogeneous
engineering approach are how we operate. This makes manufacturers’
reliance on multi-vendor operations redundant. Our common design
rules throughout the design and fabrication stages minimize the
need for compromise on off-the-shelf products, allowing us to
develop innovative ones instead.
On-time delivery
Meet all order requirements from Prototypes to volumes
ON TIME, EVERY TIME.
Quality assurance
Comply with ISO, IATF, UL standards, Online SPI, AOI, X-Ray
inspection equipment, 99.5% pass rate of product delivery.
Professional team
Expert Stackup team and 40+ High precision CAM editor team. We are
not only experienced but highly qualified.
Quick Response Service
We will respond to your enquiries and share the quotation within
12 hours.
ADVANCED MANUFACTURING CAPABILITIES
| Process / Technology | Details |
| Fuji-Nxt – Multiple SMT Lines | Single and Double Sided Selective Wave |
| IPC 610 Class 2 & 3 Assembly | Quartz Crystal Processing |
| Clean & No-Clean Process | Thick / Thin Film Microelectronics |
| PBGA (PITCH BALL GRID ARRAY) | FBGA (FINE BALL GRADE ARRAY) to 0.5mm |
| High Melting Point Solder | Chip-on-Board / Wire Bond / Chip on chip |
| HMLV (High-Mix Low-Medium-Volume) PCB Assembly | Through Hole & SMT Mixed |
| Through Hole to SMT Conversion | Complete End Product Assembly |
| Avionics LRU Assembly | Leadless Chip |
| Overflow Assembly | Fine Pitch (0201 & 01005) |
| Box Build / Final Assembly / System Integration | Multi-Chip Modules |
| In-Circuit & Functional Testing | Conformal Coating - Automated and Manual |
| BGA Rework | Automated Cleaning Solutions |
| Hotplate Soldering | Potting |
| Track Cutting & Additive Pad Fixing | Flex Rigid PCB Assembly & Test |
| RF & Microwave – Assembly & Test | Hot Plate Soldering |
TEST CAPABILITIES
| In circuit Test – HP & Teradyne | BGA Rework Stations |
| Flying Probe Tester (Takaya) | Environmental Stress & Screening (ESS) – Active & Passive |
| 2D&3D Automatic XRAY Inspection | Functional Test Design, Development, Management |
| Automatic Optical Inspection | Diagnostic Test |
| Automatic Solder paste inspection | Firmware & System Test |
| Synod & DITMICO cable test | Calibration |
| Multiple JTAG test systems | NI & Key sight ATE |
| Boundary Scan | Reverse engineering |
| High Voltage & Insulation Testing | |
CERTIFIED TEST &SCREENING FACILITY
| He / FC Bombing | Liquid Thermal Shock |
| Internal / External Visual Inspection | Thermal Humidity Bias Test |
| Fine & Gross Leak Testers | Burn in Chambers |
| Temperature Cycling (-65 to 200 deg C) | 3.5 Ton Vibration |
| Constant Acceleration | Thermal Vacuum Chamber |
